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The process can be outlined by 5 basic steps, which is then repeated thousands of times to produce a film of almost any material desired.

The 5 basic steps are:

Pulse reactive or inert gas into source chamber

Pulsed laser ablates target material creating a high temperature plasma of the target material

High Temperature plasma reacts with gas (in the case of inert gas, no reaction occurs) to form stoichiometric metal oxide or metal nitride clusters

Adiabatic expansion of reacted or unreacted molecular clusters through a nozzle from source chamber to deposition chamber to create a molecular beam.

Adsorption of cooled (through adiabatic expansion) molecular clusters onto receiving substrate that can be rotating and heated up to 950°C.

Customer Driven Equipment, Materials and Device Solutions

201 Circle Drive North, Suite 102

Piscataway, New Jersey 08854

P: 732-469-1591

F: 732-469-1592

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Laser Assisted Molecular Beam Depostion (LAMBD)

AMBP Tech provides integrated computer controlled LAMBD turnkey solutions as a system, component or add on to an existing or new PLD system.  Check out our PLD conversion brochure or our Product brochure for a complete listing of product options.

The LAMBD technology is the marriage of Pulsed Laser Deposition and Molecular Beam Epitaxy which is schematically shown below.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Typical monolayer/pulse deposition rates obtained at AMBP Tech for low defect density HfO2 are 0.2ML/pulse. Given this rate, the vacuum pumps and lasers that are commercially available that would enable 100 pulses per second, a deposition rate of 20um/hour is very possible. Currently, 3” wafers can be deposited upon. Contact us to discuss your application!!