Pulsed Laser Deposition (PLD)

Pulsed Laser Deposition is available from AMBP Tech as either a stand alone system or in coexistence with the AMBP Tech LAMBD solution.  Both systems include a multi-target carousel (three 2” targets), 3” substrate holder, rotating heater to 800C, process gas manifold and complete computer control of the process, vacuum pumps, gauges as well as trend plotting and status monitoring. 

Below, is a table comparing the LAMBD tool to the PLD tool.

Deposition Tool	LAMBD	PLD
Material Divergence Angle	Dictated by nozzle geometry, > 10 degrees	FWHM <10 degrees
Energy of incoming adatoms	~ RT molecular clusters	1eV – 100s eV
Deposition Rate (ML/pulse)	0.2ML/pulse ~30um/hr	0.2ML/pulse ~ 30um/hr
Target Materials	Any solid	Any solid
Oxide/Nitride Stoichiometry	Excellent	Good

These two deposition modes have been integrated into one tool (see systems brochure for more details) gives the user the benefit of utilizing the LAMBD technology without sacrificing being able to deposit films via the standard Pulsed Laser Deposition method.  As highlighted by the table, the LAMBD process has some very attractive advantages over conventional PLD.  Namely, LAMBD produces no surface damage since the incoming molecular clusters arrive at the substrate with virtually no energy resulting in low internal film strains, better passivation, better interface qualities and easy deposition onto low thermal budget substrates such as polymers.